cas:pace Keisuke's Secret Revealed Quicksand Japanese Phone Case

IMD In-mold Technology

Highly wear-resistant and fade-resistant

Made from high quality, durable materials

Comfortable to hold and excellent impact resistance

About the quicksand case

Air bubbles may appear inside the quicksand case, but this is not a product defect but a natural phenomenon.

Air bubbles may appear inside due to changes in temperature or air pressure, and are particularly likely to occur in high temperature environments.

If you use your smartphone while it is charging, the temperature will rise, which may cause air bubbles to form inside the quicksand.

If you are concerned about air bubbles, we recommend placing the quicksand in the refrigerator for a few minutes.

Fashion brand A store specializing in unique cases! Cas:Pace has been dedicated to the design and development of mobile phone accessories for five years, producing its own products and transforming mobile phone cases into fashion items that can express your own style.

Quality Assurance Made of high-quality, durable TPU material to protect your smartphone. Made of flexible TPU, this iPhone case protects your iPhone from drops, dents and bumps.

Good fit The snug fit keeps out dust and dirt and protects from scratches. Precise cutouts allow easy access to ports and buttons without affecting functionality.

Disclaimer:

·This product is only for compatible models. ·Installation and removal of this product are at your own risk. ·This product does not completely protect the device from scratches and dirt. ·We do not guarantee all functions and operations when this product is installed. ·If sand, dust, or other debris gets between this product and your phone, it may cause scratches. ·Before installing, remove any dust, oil, moisture, or debris from the device or this product before using. This may cause scratches on the device. ·Avoid storing this product in places with high temperatures, high humidity, or direct sunlight. ·Please note that we are not responsible for any damage, malfunction, or damage to internal data caused by using this product.